The new Ryzen AI 400 series packs Zen 5 cores, RDNA 3.5 graphics, and XDNA 2 NPUs, promising faster AI performance and improved efficiency across work, gaming, and content creation.

The AMD keynote will be presented by CEO Lisa Su. We expect to hear about a lot of AI developments -- and maybe some new silicon, too.

CES 2026 was AMD's moment to shine in the light of the ongoing AI boom, offering more chips to drive AI compute and bringing industry luminaries on stage to talk about the future.

Announced at CES 2026, AMD's latest Ryzen mobile processors will crunch up to 60 trillion AI operations per second, with the efficiency potential for multi-day battery life. Expect laptops built around them before the end of Q1 2026.

Most chips you’ll see in laptops will max out with the Ryzen AI 7 450, an 8-core CPU with a 5.1GHz clock speed and 24MB cache with only a 50 TOPS NPU. Overall, it’s a subdued update to one of AMD’s most prevalent CPUs.

The top-end Ryzen AI 9 HX 475 offers up to 12 Zen 5 CPU cores, 5.2GHz max boost speeds and up to 8,533 MT/s memory speeds. The line scales down to the four-core Ryzen AI 5 430, but even that model supports speedy 8,000 MTS RAM and offers a 50 TOPS NPU.

Su also teased additional details about its forthcoming MI500 series GPUs during her speech, saying that the chips, set to be launched in 2027, would deliver up to a 1,000x increase in AI performance compared to the AMD Instinct MI300X with AMD CDNA 6 architecture.

AMD CEO Lisa Su delivered a CES keynote that highlighted cost benefits, memory improvements, a shift toward real-world AI — and an insatiable demand for compute power.