EDN

Altera and White Electronic Designs partner on specialized mil/aero FPGA packaging

Altera Corporation and White Electronic Designs Corporation have announced a partnership that will enable military and aerospace customers access to a broad variety of packaging options for FPGAs that ...
Design-Reuse

Altera and TSMC Innovate Industry-first, UBM-free WLCSP Packaging Technology Platform for MAX 10 FPGA Products

Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have produced an innovative, UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale ...
Digi Times

Altera-TSMC tie-up to bring advanced packaging technology to Arria 10 FPGAs and SoCs

Altera and Taiwan Semiconductor Manufacturing Company (TSMC) have signed a cooperation deal that will bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20nm Arria 10 ...
EDN

Altera’s newly packaged Cyclone III FPGAs target portable applications

Claiming to provide designers with the highest density FPGA per board area, the folks at Altera have announced the availability of new 8 × 8 mm 2 packaging (M164) for its family of 65-nm Cyclone III ...
Electronics Weekly

Altera Agilex 5 FPGA dev board

Arrow Electronics is offering a starter kit development board for Altera Agilex 5 FPGAs. Called AXE5000, it is built around a A5EC008BM16AE6S, an IC with 85,196 logic elements and, for migration from ...
CIOL

XLoom reduces costs with Altera FPGA board

BANGALORE, INDIA: Altera Corp. announced that XLoom Communications is leveraging its Stratix II GX FPGA signal integrity development kit to provide a unique bit error ...
Design-Reuse

Altera and White Electronic Designs Partner on Specialized Mil/Aero FPGA Packaging

San Jose, CA and Phoenix, AZ, Nov. 20, 2006—Altera Corporation (NASDAQ: ALTR) and White Electronic Designs Corporation (NASDAQ: WEDC) today announced a partnership that will enable military and ...