Achieving high reliability and low cost package substrate compared with silicon interposer package Tokyo, December 11, 2015 --- Hitachi, Ltd. (TSE: 6501) and Hitachi Metals, Ltd. (TSE: 5486) have ...

Washington, DC, July 13, 2023 (GLOBE NEWSWIRE) -- Zion Market Research has published a new research report titled “Thick Film Ceramic Substrates Market By Type (Single-Layer And Multi-Layer), By ...

Dublin, Feb. 20, 2024 (GLOBE NEWSWIRE) -- The "Ceramic Substrates Market by Product Type (Alumina, Aluminum Nitride, Silicon Nitride, Beryllium Oxide), End-use Industry (Consumer Electronics, ...

TOKYO — Sanyo Electric Co. Ltd. has moved one step ahead in system-in-package technology with its Integrated System in Board (ISB) packaging approach. Sanyo's solution takes multiple ICs, transistors ...

Global Ceramic Substrates Market to Reach $10 Billion by 2027. Amid the COVID-19 crisis, the global market for Ceramic Substrates estimated at US$6. 6 Billion in the year 2020, is projected to reach a ...

The theme of the 24 th CEATEC will be “facilitating the realization of Society 5.0, designed to further economic development and the solution of social problems, people, technology, and information ...

Many factors affect the long-term reliability of ceramic-substrate-based chip resistors. Among those are changes in resistance due to soldering, temperature changes, or even the expected shifts in ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...