Artificial intelligence (AI) solution provider Innodisk has announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc. The flagship ...

TAIPEI, Nov. 4, 2025 /PRNewswire/ -- ARBOR Technology, a leading provider of embedded and industrial computing solutions, proudly announces the COMX-A300 Edge AI Computing Module. Built on the ...

PICMG’s COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor, announced in June 2022. The consortium for the development of open embedded computing ...

SAN JOSE, Aug. 15, 2023 — The ADLINK COM-HPC-cRLS Client type Size C module based on 13th Gen Intel Core processor is available for order with: o up to 13th Gen Intel Core i9 processor, 16 Performance ...

New COM specification will meet the increasing server-level requirements of high-end edge-computing applications. Things are really starting to heat up with regard to the amount of computing power ...

PICMG launched a COM-HPC interface specification for the management of embedded systems platforms. The goal is to help edge server engineers manage systems remotely, with a view to simplifying ...

Everyone is talking about artificial intelligence (AI). But what most people forget is that AI is nothing without high-performance computing (HPC). Any organization seeking to use or create ...

The module integrates a high-efficiency AI SoC with in-house software and peripherals to serve as a powerful Edge AI platform. TAIPEI, Jan. 6, 2026 /PRNewswire/ -- Innodisk, a leading global AI ...