With a new year upon us, many of us are looking to 2026 with at least some optimism that it will be a better year than last for many tech sectors. The electronics industry held its own last year given ...

ALEXANDRIA, Va.—ASIS International has announced its programming lineup for Global Security Exchange (GSX) 2025, with in-person and digital experiences taking place Sept. 29-Oct. 1 at the Ernest N.

James Ellsmoor, CEO of Island Innovation, moderated and participated in multiple panels at COP29 in Baku, Azerbaijan. Here, he leads the discussion on "Response to Climate Change: The Special Case of ...

CAMBRIDGE, Mass., May 28, 2025 /PRNewswire/ -- Nonprofits report difficulty pursuing their missions in a complex environment shaped by the current political climate and future economic uncertainty in ...

The accreditation process can be challenging for ASCs, but it remains one of the best ways for facilities to demonstrate their commitment to patient safety. Here, leaders from three leading ...

Researcher at DEF CON reveals some critical challenges in widely used SSH protocol and provider recommendations on how to make it better. The Secure Shell (SSH) protocol serves as the backbone of ...

RSAC CONFERENCE 2025 – San Francisco – US critical infrastructure sectors face a wide range of security challenges, forcing federal government leaders to find new advantages in the form of automation ...

Seemant Sehgal is Founder & CEO of BreachLock Inc., a leader in Continuous Attack Surface Discovery & Penetration Testing as a Service. In 2024, the cybersecurity landscape reached an unprecedented ...

Alaska Air Group has released a white paper calling for urgent modernization of the US air traffic control system. The paper argues that the national airspace system (NAS) is strained by decades-old ...

Every year brings formidable challenges for educators, but the upcoming 2025-26 school year seems to portend an especially pivotal time for Long Island students, parents and teachers. Will artificial ...

A new technical paper titled “Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science” was published by researchers at the National ...