SAN JOSE, Calif. — Following possible shortages and supply-chain disruptions in the market, Japan's Shin-Etsu Chemical Co. Ltd. (SEH) has recently increased the prices for its epoxy molding ...
VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...
Toughened epoxy system EP21FL has a 4 to 1 mix ratio by weight and cures at ambient temperature. It has a low mixed viscosity of 2,000-4,500 cps. EP21FL has excellent electrical insulation properties ...
SAN DIEGO--(BUSINESS WIRE)--Kyocera announced today that its North American sales organization for epoxy molding compounds, die attach pastes, and all other semiconductor encapsulation products was ...
Epoxies are the most widely used polymeric materials for adhesives, sealants, coatings, pottings and encapsulations and impregnants. They are available in both one and two component systems. Two part ...
Master Bond’s latest epoxy innovation, Super Gel 9, is a urethane modified epoxy gel featuring outstanding, unique properties. It is often used as a sealant and encapsulant for very challenging ...
Key semiconductor material distributor Chang Wah Electromaterials (CWE) has announced new pricing for epoxy molding compounds effective from the third quarter of 2024, due to a weak Japanese Yen. Save ...
“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...
The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources. Sumitomo Bakelite, now ...
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