A new-generation “workhorse” grade of DuPont™ Zenite® LCP liquid crystal polymer resin promises more strength, toughness and precision for electronic connectors and other moulded components. “Tests ...
"With technical assistance from Ticona, JST was able to switch to Vectra S135 and start molding thin-wall parts with excellent process consistency and good surface appearance," says Miguel Padilla, ...
LONDON — Quantum Leap Packaging Inc. (QLP), a provider of electronics component packaging that uses liquid crystal polymer (LCP) compounds, is to receive $20 million in equity finance from Sumitomo ...