SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, has introduced new chip-on-board (COB) LED package lineups, including small LES ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...

Following research at Sheffield-based LED packaging firm Litecool, narrow beam angles from LED packages without secondary optics or reflectors look closer. The proof-of-concept device produced a beam ...

Samsung Electronics introduced a full line-up of chip-scale LED packages (CSP), including 0.6-W-class and 3-W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung’s CSP technology ...

(Phys.org)—Many researchers have reported improvements in LED technology by enhancing the properties of the LED itself. But the packaging that secures and protects the LED also impacts its overall ...

Multi-die packages are currently the ‘flavour of the month’ amongst the high power led manufacturers. Certainly for both manufacturers and designers chasing the title of ‘highest lumen output’ device, ...

MANCHESTER, England, March 17, 2025 /PRNewswire/ -- Smartkem (NASDAQ: SMTK), which is seeking to change the world of electronics with a new class of transistor technology, will unveil the first ...

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