Researchers at MIT have developed a fabrication approach that stacks multiple active components on the back end of a ...
HSINCHU, Aug. 24, 2021 /PRNewswire/ -- AP Memory Technology Corp ("AP Memory", TWSE: 6531) announced successful demonstration of Very High-bandwidth Memory (VHM™), the true 3D integration of DRAM and ...
Nanoelectromechanical systems (NEMS) represent a transformative approach in the design of memory and logic devices, offering unprecedented energy efficiency and integration potential with standard ...
SEMI, the leading international semiconductor trade organization held its Semicon conference in San Francisco in July. SEMI predicts significant growth in semiconductor equipment demand in 2022 and ...
Imec is a semiconductor and nanotechnology research center in Belgium. They recently made several announcements and a briefing on their developments. Imec works on health and many other areas but they ...
Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at ...
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MIT's chip stacking breakthrough could cut energy use in power-hungry AI processes
Data doesn’t have to travel as far or waste as much energy when the memory and logic components are closer together.
Micron Technology, Inc. and other memory companies have substantial inventories to work through, as revenues plummet. The logic/foundry IC sector will not exhibit the revenue plunge in 2023 as will ...
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