Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

ST Assembly Test Services Ltd. (STATS) today said it has completed qualification of its front-end assembly operations for 300mm packaging. The Singapore-based company said the automated front-of-line ...

WILLOW GROVE, Pa. — Kulicke & Soffa Industries Inc. today announced it has extended its technology licensing arrangement with Amkor Technology Inc. to include wafer-level chip-scale packaging ...

How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...

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The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...