RESEARCH TRIANGLE PARK, N.C. — Flip-chip technology supplier Unitive Inc. here today announced qualification of its eutectic wafer-bumping process for volume production of high-density ...

TAIPEI, Taiwan — Advanced Semiconductor Engineering Inc., a supplier of packaging and testing services, has said that it has electroplated wafer bumping technology on 200-mm wafers and has begun a ...

Here, Vidya Vijay, Director of Business Development at Nordson Test and Inspection, examines how intelligent in-situ sensing ...

Custom DC positioners with theta-X planarizing capability and true Kelvin probes have allowed for successful demonstration of consistent and repeatable test results in fully automatic micro-bump wafer ...

MINNEAPOLIS--(BUSINESS WIRE)-- CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the SEMICON ...

Interconnect, a wafer bumping service company, announced qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications, producing bonds that are stable at high ...

At the recent IEEE Electronic Components and Technology Conference (ECTC), Imec presented a paper on a fine-pitch hybrid wafer-to-wafer bonding technology for heterogeneous integration. Imec described ...

This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...

Nordson MARCH Addresses the Ways Plasma Treatment during Fan-out Wafer and Fan-out Panel-Level Semiconductor Packaging Maximizes Performance and Optimizes Costs In recent years, there has been an ...

The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...