Even worse, chips and systems are now so complex that it may require a unique sequence of operations to trigger a silent data error, and they may only show up occasionally, and maybe only after months ...

A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review” was published by researchers at Chungbuk National University.

The latest advancements in these specifications and their potential to change vision and imaging technologies.

A platform-based approach to multiphysics simulation that gives engineering teams the tools to design, verify, and optimize ...

Smaller models and accelerated compute are transforming AI at the edge.

Ferguson: This is a big part of what’s driving consolidation within the EDA industry. You see Siemens and Mentor and Altair ...

Intent and integrity in signoff; LPDDR in data centers; PCB stackup materials; what's new in MIPI; analog challenges.

An overview of the MRDIMM technology as a solution to memory bandwidth and capacity challenges.

EDA and silicon IP revenue grew 12.8% in Q1 2025, totaling $5.098 billion compared to $4.522 billion in the same period last ...

Cognichip’s approach is to develop a physics-informed foundation model that achieves more parallelism than is available in ...

Evaluating CPU Fuzzers via Automatic Bug Injection” was published by researchers at ETH Zurich. Abstract “Hardware fuzzing has recently gained momentum with many discovered bugs in open-source RISC-V ...

Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...